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Rogers 4835 Datasheet

High Frequency Circuit Materials

Oxidation affects all thermoset laminate materials over time and temperature, including
FR-4. In the long term, oxidation can lead to small increases in dielectric constant and
dissipation factor of the circuit substrate. The rate of change and impact on circuit
performance depends on design and operating temperature. For applications demanding
greater stability at elevated temperatures Rogers has developed RO4835™ laminate, that
is signifi cantly more resistant to oxidation than other hydrocarbon based materials.*
Moreover, RO4835 material provides nearly identical electrical and mechanical properties
to RO4350B™ laminates, which customers have used successfully for many years. As part
of the RO4000® hydrocarbon ceramic laminate family, RO4835 laminates are designed to
offer superior high frequency performance and low cost circuit fabrication. The result is
a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes

offered at a competitive price.

The selection of laminates typically available to designers is signifi cantly reduced once
operational frequencies increase to 500 MHz and above. RO4000® material possesses
the properties needed by designers of RF microwave circuits and matching networks and
controlled impedance transmission lines. Low dielectric loss allows RO4000 series material
to be used in many applications where higher operating frequencies limit the use of
conventional circuit board laminates. RO4000 material’s thermal coeffi cient of expansion
(CTE) provides several key benefi ts to the circuit designer. The expansion
coeffi cient of RO4000 material is similar to that of copper which allows the material to
exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer
board constructions. The low Z-axis CTE of RO4000 laminates provides reliable plated
through-hole quality, even in severe thermal shock applications. RO4000 series material has
a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range
of circuit processing temperatures.

RO4000 series laminates can easily be fabricated into printed circuit boards using standard
FR-4 circuit board processing techniques. Unlike PTFE based high performance materials,
RO4000 series laminates do not require specialized via preparation processes such as
sodium etch. This material is a rigid, thermoset laminate that is capable of being processed
by automated handling systems and scrubbing equipment used for copper surface
preparation. RO4835 laminates utilize RoHS compliant fl ame-retardant technology for
applications requiring UL 94V-0 certifi cation. These materials conform to the requirements
of IPC-4103, slash sheet /11.

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