6 Layer multilayer stack up PCB thickness 1.2mm printed circuit board

Quick detail:

Layer：6 L

Material: FR4

Special: Blind hole

Thickness:2.0mm

Board size: 9*17CM

Copper thickness:1OZ

Name: 6 layer multilayer bline hole customized PCB manufacturer in china

Min line:8mil

Min hole: 0.3MM

Surface finish: Immersion gold

PCB sample prototype: Support

6 Layer PCB allocation scheme

Generally,we recommend three ways for 6 layer pcb

First,Layer 1,2,5,6 is signal layer.Layer 3 is GND.Layer 4 is Power.meanwhile,Layer 1,6 are copper,please see below:

Layer 1                Signal（Top Copper）

Layer 2                Signal

Layer 3                Ground

Layer 4                Power

Layer 5                Signal

Layer 6                Signal (Bottom Copper)

Remark: In this scheme, special attention should be paid to reduce the top layer and bottom layer signal mutual interference. For high-speed signals to ensure that meet the spec requirements of the impedance. The trace requires a reference plane to ensure impedance control

Second, Layer 1,3,4,6 is signal layer.Layer 2 is GND.Layer 5 is Power.Layer 1,6 with copper foil.Layer 3,4 is high speed signal, please see below:

Layer 1                Signal（Top Copper）

Layer 2                Ground

Layer 3                Signal  - high speed

Layer 4                Signal – high speed

Layer 5                Power

Layer 6                Signal (Bottom Copper)

Remark: In this scheme, a sensitive clock signal or associated high-speed signal can be routed between the power planes.

Third,Layer 2,3,6 is signal layer.Layer 1 is GND.Layer 4 is Power.Layer 5 is GND.Layer 2,3 is high speed signal,please see below:

Layer 1                Ground with pad cutouts

Layer 2                Signal –high speed

Layer 3                Signal  - high speed

Layer 4                Power

Layer 5                Ground

Layer 6                Signal (Bottom Copper)

Remark: This scheme, with the top layer as GND, appears to be inefficient, but this can reduce about 30% of the vias (many pins are connected directly to GND), greatly improving the wiring efficiency of the second layer. Many high-density wiring experts recommend and recommend this approach. This scheme can also reduce EMI effectively.

6 Layer Multilayer PCB fabrication:

Generally multilayer PCB manufacturing methods by the inner graphics firstly, and then made by printing etching single or double-sided substrate, and included in the designated layer, and then by the heat, pressure and bonding, as for the subsequent drilling Hole and double-panel plating the same hole method.

Advantages of multilayer PCB:

Advantages: high assembly density, small size, light weight due to the high assembly density, the components (including components) to reduce the connection between, thus improving the reliability; can increase the number of wiring layers, thereby increasing design flexibility; Can form a high-speed transmission circuit; can set the circuit, the magnetic circuit shielding layer, can also be set to the metal core cooling layer to meet the shielding, cooling and other special features; simple installation, high reliability.

Disadvantages: high cost; long cycle; the need for high-reliability means of detection. Multi-layer printed circuit is the electronic technology to high-speed, multi-function, large capacity, small volume direction of the product. With the continuous development of electronic technology, especially large-scale and ultra-large-scale integrated circuits widely used in-depth, multi-layer printed circuit is rapidly to the high-density, high-precision, high-level direction of the number of t micro-lines, , Blind hole buried hole, high plate thickness ratio of the technology to meet the needs of the market.