What does BGA means in circuit board manufacturers?

What does BGA means in circuit board manufacturers?

What does bga mean? The full name of BGA is "Ball Grid Array", which means the PCB with ball grid array structure. It is a packaging method of integrated circuit using organic carrier board. PCB boards with BGA generally have many small holes. Generally, the lower hole of BGA is designed as a finished hole with a diameter of 8~12mil. The lower hole of BGA needs to be plugged, and the pad is not allowed to be inked, and the pad is not drilled

1: The function of BGA: ① The packaging area is reduced. ② The number of pins increases with more functions. ③ PCB board can be self-centered and easily tinned during solution welding. ④ High reliability. ⑤ Good electrical performance and low overall cost.

2: General rules for BGA pad design: ① The pad diameter is usually smaller than the pad diameter. In order to obtain reliable adhesion, it is generally reduced by 20% - 25%. The larger the pad, the smaller the wiring space between the two pads. ② The following formula gives the calculation of the number of wiring between two pads, where P is the package spacing, D is the pad diameter, n is the number of wiring, and x is the line width. P-D ≥ (2n+1) x ③ The pad on the PBGA substrate and the pad on the PCB have the same diameter. ④ CBGA's pad design should ensure that the template opening can make the solder paste leakage ≥ 0.08mm3, which is the minimum requirement to ensure the reliability of the solder joint.