What is the tombstone of the Printed Circuit Board? ONESEINE PCB fabrication companies will give you a comprehensive understanding of this article

What is the tombstone of the printed circuit board? ONESEINE PCB fabrication companies  will give you a comprehensive understanding of this article

In the process of circuit board manufacturing and assembly, "circuit board tombstone" is a problem that is often mentioned and needs attention. So, what does circuit board tombstone mean? Let's listen to how ONESEINE editor answers.

Circuit board tombstone, also known as the "Manhattan phenomenon", vividly describes the phenomenon that during the reflow soldering process, one end of the patch component is soldered on the pad, while the other end stands upright, standing on the circuit board like a high-rise building. This phenomenon seriously affects the soldering quality and electrical performance of the circuit board, and is a problem that must be avoided in circuit board production.

There are many reasons for the tombstone phenomenon of the circuit board. The first is that the two ends of the component are heated unevenly. During reflow soldering, if the temperature rise rate at both ends of the component is inconsistent, it will cause the solder to melt at different times. The surface tension generated by the end that melts first will pull the component to tilt toward this end and eventually stand upright. Secondly, unreasonable pad design can also cause tombstone phenomenon. For example, inconsistent pad size and inappropriate spacing will affect the distribution and surface tension of the solder, thereby increasing the risk of tombstone formation. In addition, factors such as patch offset, component weight and shape may also lead to tombstone formation.

In order to prevent the tombstone formation of circuit boards, we can take a series of effective measures. In terms of soldering process, the temperature curve of reflow soldering should be optimized to ensure that both ends of the component can be heated evenly. By accurately controlling the heating rate and peak temperature, the solder can be melted at the same time to reduce the difference in surface tension. In pad design, the consistency of pad size and spacing should be ensured so that the solder can be evenly distributed. At the same time, the accuracy of the patch should be improved to avoid component offset. In the production process, some auxiliary tools and technologies, such as jigs and preheating, can also be used to improve the stability and reliability of soldering.