PCB Printed Circuit Boards production process

Printed Circuit Boards production process

1, Cut material

Purpose: According to the requirements of the engineering data MI, on the large sheets that meet the requirements, cut into small pieces to produce plates. Small pieces of materials that meet customer requirements.

2, drilling

Purpose:  According to the engineering data (customer data), drill the desired hole diameter in the corresponding position on the board that meets the required size.

3, Immersion copper

Purpose: To deposit copper on the wall of insulating hole by chemical method.

4, graphics transfer

Purpose: Graphical transfer is to transfer the image on the film to the board

5, graphics plating

Purpose: Pattern plating is to plate a layer of copper to the required thickness and the required thickness of gold or tin on the bare copper skin or hole wall of the circuit pattern.

Purpose: To remove the anti - plating film by NaOH solution to expose the non - copper layer.

6, etching

Purpose: Etching is the use of chemical reaction method to etch away the non-line copper layer.

7, Solder mask

Purpose: Green oil is the transfer of the green oil film to the board, which plays a role in protecting the circuit and blocking the soldering of parts.

8, character

Purpose: Characters are an easy-to-identify marker

9, gold-plated finger

Purpose: Plating a layer of nickel/gold with a desired thickness on the plug finger to make it more wear resistant

Process: Upper plate → degreasing → washing twice → micro etching → washing twice → pickling → copper plating → washing → nickel plating → washing → plating

10, (a side-by-side process), tin plate

Purpose: Spray tin is sprayed with a layer of lead and tin on the exposed copper surface that is not covered with solder resist to protect the copper surface from corrosion and oxidation to ensure good soldering performance.

Process: Micro-etching → Air drying → Preheating → Rosin coating → Solder coating → Hot air formation → Air cooling → Wash air drying

11, molding

PURPOSE: To use the method of molding or molding the shapes required by the customer by die stamping or numerically controlled crucibles. Organic crucibles, beer board, hand picks, hand cuts

Explanation: The precision of data-board and board is high, followed by hand-rolling. The minimum amount of hand-cutting board can only be done in some simple shapes.

12, test

Purpose:To detect defects such as open circuits and short circuits that are not easily detected by electronic tests.

13, final inspection

Purpose: By visually inspecting the appearance defects of the panel and repairing minor defects to avoid problems and defective plate outflow.