Analyze the optimization method of excessive solder joints in PCB design

Analyze the optimization method of excessive solder joints in PCB design

The PCB design solder joints are too dense, which may cause continuous wave soldering and leakage between solder joints. The following editors will analyze the optimization methods of overdense solder joints in PCB design.

Analysis: This board has many plug-in components and is relatively dense. Because the distance between the solder joints and the solder joints is 0.3-0.5mm, it is easy to cause continuous welding. At the same time, because of the poor quality of the flux, a large amount of electricity leakage occurs in the southern Meiyu weather.

     Countermeasures: Increase the distance between solder joints and increase the solder resist oil in the middle. Strict control of flux quality.

     Thinking: When designing a dense PCB, make it as small as possible, and pull as far as possible. For example, although the safe distance of the PCB is 0.3MM, the place where the 0.6MM can be achieved is increased to 0.6 or more, so that the probability of problems will be greatly reduced.