1.0MM withstand voltage
Thermoelectric separation process copper foil thickness
ULE354470/ISO/SGS Thermal Conductivity
Solder mask type
White oil surface treatment
100% computer open short circuit test
Sample: 3-5 days Batch: 5-7 days
Generally, there are a gold-plated copper substrate, a silver-plated copper substrate, a tin-plated copper substrate, an anti-oxidation copper substrate, and the like.
Copper base substrate
The copper substrate circuit layer is required to have a large current carrying capacity, so a thick copper foil should be used, and the thickness is generally 35 μm to 280 μm; the thermal conductive insulating layer is the core technology of the copper substrate, and the core thermal conductive component is aluminum oxide and silicon powder. It consists of a polymer filled with epoxy resin, low thermal resistance (0.15), excellent viscoelasticity, resistance to heat aging, and ability to withstand mechanical and thermal stresses. The copper substrate metal base layer is a supporting member of the copper substrate, and is required to have high thermal conductivity, generally a copper plate, or a copper plate (in which the copper plate can provide better thermal conductivity), which is suitable for conventional machining such as drilling, punching and cutting.
Contact: Ms Tracy
Phone: 0086 18682010757
Tel: 0086 18682010757
Add: BludingA,Shixiaganglian Industrial Park,Shajing,Baoan,Shenzhen,China