Processing flow of buried blind via PCB circuit board

Processing flow of buried blind via PCB circuit board

The processing flow of buried blind via PCB circuit board is a complex process involving multiple steps and technologies. The following is a detailed explanation of the processing flow of buried blind via PCB circuit board.

1. Preparation for production

Before starting to make buried blind via PCB circuit board, some preparation work needs to be done. This includes selecting the right materials and making a detailed production plan. For example, it is necessary to determine whether to use a double-sided board or a multi-layer board, and whether the board surface thickening copper plating process is required.

2. Material preparation

According to the production plan, the copper clad board is cut and the circuit board is made with a photosensitive board. The copper clad board is then pretreated to prepare for the subsequent production steps.

3. Transfer circuit board

Next, the circuit design is transferred to the copper clad board by transfer. This process is usually completed using a UV exposure machine.

4. Etching circuit board

Etching is an important step in the production of circuit boards. In this step, chemicals are used to etch the copper clad board to form the desired circuit pattern. It should be noted that the etching process needs to control the time and temperature to avoid damage to the circuit.

5. Drilling

Drilling is one of the key steps in making buried and blind via PCBs. In this process, a drilling machine is used to drill through holes and blind holes on the board. It should be noted that the accuracy of drilling directly affects the quality and performance of the circuit board.

6. Hole plating

Hole plating refers to electroplating in the drilled holes to ensure that there is sufficient metal plating inside and outside the holes. This process is essential to improve the corrosion resistance and conductivity of the circuit board.

7. Lead-tin plating

Lead-tin plating is a pretreatment step in the production of circuit boards. In this process, the surface of the circuit board is coated with a layer of lead-tin alloy to improve its oxidation resistance and welding performance.

8. Etching

Etching is the last major process in the production of circuit boards. In this process, chemicals are used to etch the circuit board that has been coated with solder mask to form the final circuit pattern.

End inspection

After all the production steps are completed, the circuit board needs to undergo a series of inspections to ensure that its quality meets the standards. This includes appearance inspection, dimensional measurement, electrical testing, and functional testing.

The above is the basic processing flow of buried and blind via PCB circuit boards. It should be noted that the specific production methods and steps may vary depending on the design of the circuit board and the required technical requirements. In actual operation, adjustments and improvements should be made according to specific circumstances.