Rogers TMM® Thermoset Microwave Materials

 DOWNLOAD

Rogers TMM® Thermoset Microwave Materials

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset

polymer composites designed for high plated-thru-hole reliability stripline

and microstrip applications. TMM laminates are available in a wide range of

dielectric constants and claddings.

The electrical and mechanical properties of TMM laminates combine many of

the benefits of both ceramic and traditional PTFE microwave circuit laminates,

without requiring the specialized production techniques common to these

materials. TMM laminates do not require a sodium napthanate treatment prior

to electroless plating.

TMM laminates have an exceptionally low thermal coefficient of dielectric

constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of

thermal expansion, very closely matched to copper, allow for production of high

reliability plated through holes, and low etch shrinkage values. Furthermore, the

thermal conductivity of TMM laminates is approximately twice that of traditional

PTFE/ceramic laminates, facilitating heat removal.

TMM laminates are based on thermoset resins, and do not soften when heated.

As a result, wire bonding of component leads to circuit traces can be performed

without concerns of pad lifting or substrate deformation.

TMM laminates combine many of the desirable features of ceramic substrates

with the ease of soft substrate processing techniques. TMM laminates are

available clad with 1/2 oz/ft2

 to 2 oz/ ft2

 electrodeposited copper foil, or bonded

directly to brass or aluminum plates. Substrate thicknesses of 0.015” to 0.500” are

available. The base substrate is resistant to etchants and solvents used in printed

circuit production. Consequently, all common PWB processes can be used to

produce TMM thermoset microwave materials.

Features and benefits:

Wide range of dielectric constants

• Ideal for single material systems on a

wide variety of applications

Exceptional mechanical properties

• Resist creep and cold flow

Coefficient of thermal expansion matched

to copper

• High reliability of plated through holes

Resistant to process chemicals

• Reduces damage to material during

fabrication and assembly processes

Thermoset resin

• Reliable wirebonding

• No specialized production

techniques required

• TMM10 and 10i laminates can

replace alumina substrates

Some Typical Applications:

• RF and microwave circuitry

• Power amplifiers and combiners

• Filters and coupler

• Satellite communication systems

• Global Positioning Systems Antennas

• Patch Antennas

• Dielectric polarizers and lenses

• Chip testers