Low Dk/Df and High Thermal Reliability Material Core: TU-872 SLK; Prepreg: TU-87P SLK TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced
with regular woven E-glass and designed with low dielectric constant and low dissipation factor
for high speed low loss and high frequency multilayer circuit board application. TU-872 SLK
material is suitable for environmental protection lead free process and also compatible with FR-4
processes. TU-872 SLK laminates also exhibit excellent moisture resistance, improved CTE, superior
chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network
forming compound.
Main Applications Radio Frequency Backpanel, High performance computing Line cards, Storage Servers, Telecom, Base station Office Routers
Key Features Excellent electrical properties Dielectric constant less than 4.0 Dissipation factor less than 0.010 Stable and flat Dk/Df performance Compatible with modified FR-4 processes Excellent moisture resistance and Lead Free reflow process compatible Improved Z-axis thermal expansion Anti-CAF capability Superior dimensional stability, thickness uniformity and flatness Excellent through-hole and soldering reliability
Tracy
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