Multilayer FR4 Rigid PCB Board: Specifications, Material Grades & Manufacturing Capabilities
FR4, or glass fiber epoxy laminate, is the dominant base material for rigid printed circuit board production. This flame-retardant epoxy-glass composite is available in multiple surface color options including yellow, white, black and blue FR-4 variants. It has become the universal standard for subtractive PCB fabrication thanks to its excellent compatibility with various manufacturing processes and stable performance across application scenarios.
As an established FR4 PCB manufacturer and exporter based in China, we offer a comprehensive range of FR4 material grades to fulfill diverse customer requirements. All our FR4 rigid PCBs comply with RoHS environmental regulations, with verified material quality, competitive pricing and end-to-end one-stop services to safeguard customer project outcomes.
Thermally stable FR4 copper-clad laminates deliver high mechanical strength, reliable machinability and outstanding electrical insulation properties. They are widely used for single-sided and double-sided board manufacturing, providing an optimal balance of processing flexibility and finished board performance for most SMT assembly applications.
1. FR4 Copper Clad Laminate (CCL) Grade Classification
FR4 copper clad laminate is the core raw material of rigid PCBs, and is divided into three performance grades to match different application reliability requirements and cost budgets.
FR-4 A1 Grade CCL
As the highest-performance FR4 grade with world-class technical indicators, A1 grade CCL is mainly applied in high-reliability electronic products including military equipment, communication systems, computers, digital circuits, industrial instrumentation and automotive electronics. Its comprehensive performance can meet the strict requirements of nearly all electronic application scenarios, representing the top tier of FR4 material performance.
FR-4 A2 Grade CCL
This mid-range FR4 grade is designed for general computer products, instrumentation, high-end home appliances and ordinary electronic devices. It is widely adopted in industrial electronic products with standard performance requirements, delivering excellent cost-effectiveness to help customers improve product market competitiveness.
FR-4 A3 Grade CCL
This entry-level FR4 grade is developed for household appliances, computer peripherals and general consumer electronic products such as toys, calculators and game devices. It maintains all basic performance required for standard applications, with highly competitive pricing for cost-sensitive mass production projects.
2. Multilayer FR4 PCB Applications & Manufacturing Advantages
Specializing in high-reliability multilayer PCB technology, we serve as a trusted fabrication partner for military, aerospace and industrial electronic customers worldwide. We prioritize customer-centric service, working closely with clients through full interactive collaboration to deliver customized PCB solutions tailored to specific project needs. Many long-term clients regard us as their equivalent of an in-house captive printed circuit board fabricator.
Our FR4 rigid PCBs and advanced material circuit boards serve a wide range of industries, including telecommunications, medical equipment, industrial instrumentation, pipeline & oil logging, military defense, automated test equipment (ATE) and aerospace. Beyond standard FR4 multilayer boards, we also support fabrication with special materials such as Teflon and polyimide, as well as metal-backed, flexible and rigid-flex PCB solutions.
3. Available Surface Finish Options
We provide a full selection of surface finish technologies to match different assembly processes, reliability requirements and application scenarios:
White Tin
Immersion Silver
Electroless Nickel - Immersion Gold (ENIG)
SMOBC (Soldermask Over Bare Copper)
HASL (Hot Air Solder Level) with 60/40 Tin/Lead
Lead-Free HAL (Hot Air Solder Level)
Nickel - Palladium - Gold (Ni/Pd/Au)
Deep Nickel - Gold (Hard Gold)
OSP (Organic Solderability Preservative)
Selective Gold with SMOBC/HASL
Selective Gold with Immersion Finishes
4. Core Manufacturing Capabilities & Technical Specifications
We maintain up-to-date production capabilities to support complex high-density and high-reliability PCB designs, covering the following core process technologies:
Multilayer board fabrication up to 36 layers
Flexible and rigid-flex PCB production
Double-sided rigid PCB manufacturing
Blind and buried via technology
RF Teflon PCB fabrication from 1 layer to 14 layers
Down-hole logging PCBs with polyimide substrate and nickel-palladium-gold finish
Controlled impedance design with Polar Instrument TDR test reports
Solder mask over bare copper (SMOBC) process
Dry film solder mask application
Selective or deep nickel/gold plating (hard, soft and immersion gold types)
SMT (Surface Mount Technology) and BGA (Ball Grid Array) board support
Plugged vias with silver conductive epoxy filling, supporting aspect ratios up to 32:1
Fine line and spacing down to 3 mils
Mechanical drilling capability down to 4 mils
Fine pitch SMT support down to 10 mils pitch
V-groove jump scoring for board separation
5. Standard FR4 Rigid PCB Product Specifications
Our baseline FR4 rigid PCB offering covers the following standard specifications, with fully customizable parameters available for custom project requirements:
Raw material: FR-4 rigid PCB substrate
Layer count: 2-layer (supports up to 36 layers for custom multilayer designs)
Board thickness: 1.6mm
Copper thickness: 2.0oz
Surface finish: ENIG (Electroless Nickel Immersion Gold)
Conclusion
FR4 rigid PCB remains the most versatile and cost-effective solution for the majority of electronic product designs. From single-sided consumer boards to 36-layer high-reliability multilayer boards for aerospace and defense, graded FR4 materials can match a wide spectrum of performance requirements and cost targets. With full surface finish options, advanced process capabilities and strict quality control, we deliver reliable, RoHS-compliant FR4 PCB products with one-stop support for diverse industry applications.
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Contact: Ms Tracy
Phone: 0086 18682010757
Tel: 0086 18682010757
Add: Building9,Xinyuan Industrial Park,Tangwei,Fuyong,Baoan,Shenzhen,China