Analysis and elimination of PCB plating problems

Analysis and elimination of PCB plating problems

1. Reasons for poor adhesion between copper plating layers and treatment methods

    ① Reason: insufficient water washing after developing the dry film. Treatment measures: check the dry film process and the washing conditions of the development and improve.

    ② Reason: The power supply is not turned on after the PCB board enters the plating tank. Treatment measures: recheck the automatic program of the rectifier.

    ③Cause: The wetting agent in the oil removal tank is brought out or the water is not washed enough to cause the passivation of the bottom copper. Treatment measures: Check the washing procedure, increase the washing water flow and increase the washing water temperature.

    ④ Reason: Improper cleaning treatment before electroplating, and the oxidation or passivation film on the bottom copper surface is not completely removed. Treatment measures: increase the temperature of the oil removal tank to facilitate the removal of oil stains and fingerprints, check the activity of the oil removal tank and the micro-etching tank and improve it.

    2. Partial leakage or step plating of copper plating

    ① Reason: Too much organic matter in the plating solution. Treatment measures: activated carbon treatment of copper plating solution.

    ② Reason: It is caused by the dry film development is not clean. Treatment measures: recheck the developing conditions of the dry film.

    ③Reason: There are fingerprints and oil stains on the PCB surface. Treatment measures: increase the temperature of the degreasing tank liquid before electroplating.

    ④Reason: The developer is oozing from the surface of the dry film. Treatment measures: After developing, it must be placed for 30 minutes before electroplating to balance the reaction.