Multilayer pcb board thickness

Process Capability And Checking Parameters(Rigid PCB Board)

NO

ITEM

Technical Capabilities

1

Layers

1-38L

2

Max.Board Size

1200*610mm

48"*24"

3

Finished Board Thickness

0.2mm--10.0mm

0.008"--0.4"

4

Finished Copper Thickness

17um-420um

0.5OZ--12OZ

5

Min.Trace Width/Space

0.075mm/0.065mm

0.003"/0.0026"

6

Min.Hole Size

0.15mm

0.006"

7

Hole Dim. Tolerance(PTH)

±0.05mm

±0.002"

8

Hole Dim.Tolerance(NPTH)

±0.05mm

±0.002"

9

Drill Location Tolerance

±0.05mm

±0.002"

10

V-Cut Degrees

20-90 ºC

20DEG-90DEG

11

Min.V-Cut PCB Thickness

0.4mm

0.016"

12

N/C Routing Tolerance

±0.1mm

±0.004"

13

Min.Blind/Buried Via

0.15mm

0.06"

14

Plug Hole Size

0.2mm--0.6mm

0.008"--0.024"

15

Min.BGA PAD

0.2mm

0.008"

16

Materials

FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB

17

Surface Finish

HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F

18

Warp & Twist

≤0.75%

19

Electrical Testing

50--300V

20

Solderability Testing

245±5ºC,3sec Wetting area least95%

21

Thermal Cycling Testing

288±5ºC,10sec,3cycles

22

Ionic Contamination Testing

Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23

Soldmask Adhesion Testing

260ºC+/-5, 10S,3times