Precautions for blind buried via PCB circuit boards

Precautions for blind buried via PCB circuit boards

Blind buried via PCB circuit boards have been widely used in many high-end electronic products due to their advantages of high density, high performance and miniaturization. However, to successfully design and manufacture blind buried via PCBs, it is necessary to pay attention to the following key points:

1. Design specifications

Follow the standards: When designing blind buried via PCBs, it is necessary to follow the relevant standards formulated by authoritative organizations such as the International Electrotechnical Commission (IEC) and the American Electronic Industry Alliance (JEDEC).

Design rules: Select appropriate design rules, such as line width, line spacing, number of wiring layers, etc., while considering issues such as signal integrity, thermal performance and electromagnetic compatibility.

2. Material selection

Electrical performance: Select materials with good electrical performance, such as FR-4, CEM-3, aluminum substrates, etc.

Thermal stability: Consider the thermal stability of the material, especially for high-performance computing and power electronics applications.

Processability: Select materials that are easy to process to reduce manufacturing difficulty and cost.

3. Hierarchical layout

Power layer and ground layer: Reasonably distribute the power layer and ground layer to ensure the stability of the power and ground lines.

Signal line direction: optimize the direction of signal lines, reduce signal interference, and improve signal transmission quality.

4. Through-hole layout

Blind and buried vias: correctly select and layout blind and buried vias to avoid unnecessary complexity.

Number of through-holes: reduce the number of through-holes, especially in high-density interconnect (HDI) boards, to improve wiring density and signal integrity.

5. Manufacturing process

Drilling technology: use cooling drilling technology to avoid fine cracks on the PCB surface caused by high-speed drilling.

Copper film quality: ensure the quality of copper film, because the quality of copper film has a great influence on the quality and precision of blind holes.

Bonding process: prevent electrolyte and electrolyte in high-temperature pressing process from penetrating into the blind hole during bonding process, affecting the quality and conductivity of blind holes.

Glue removal and stripping: thoroughly remove the pressure-sensitive adhesive around the blind hole to avoid glue residue affecting the connection quality.

6. Environmental control

Temperature and humidity: control the temperature and humidity of the environment during the manufacturing process to ensure that the final PCB blind hole board is of stable quality and high reliability.

7. Testing and Verification

Functional testing: Functional testing is performed after manufacturing is completed to ensure the performance and reliability of the circuit board.

Signal integrity testing: Signal integrity testing is performed to ensure the quality of signal transmission.

Through the above considerations, high-quality blind and buried via PCB circuit boards can be effectively designed and manufactured to meet the strict requirements of high-performance electronic products.