There are many processes for mobile phone and computer circuit boards, electronic circuit manufacturers

There are many processes for mobile phone and computer circuit boards, electronic circuit manufacturers

We are involved in the circuit board business of high-frequency devices such as mobile phones and computers. In addition to the most basic multilayer board process, there are some other processes that also play a key role.

High-density interconnect (HDI) technology is very popular at present. Mobile phones and computers are constantly pursuing miniaturization and high performance, and the HDI process just meets this demand. In mobile phones, it uses smaller line width, spacing and micro-hole technology to integrate more circuits and components in a limited space. Complex parts such as 5G modules and high-pixel camera circuits in mobile phones rely on HDI technology to achieve efficient layout, which improves the performance and functional diversity of mobile phones. High-performance laptops also benefit from this, optimizing circuits in a thin and light body and enhancing overall performance.

Surface mount technology (SMT) is also a common process. It changes the traditional way of component installation and greatly improves production efficiency by directly mounting electronic components on the PCB surface. In the production of mobile phones and computers, a large number of small patch components such as resistors, capacitors, chips, etc. use SMT technology. This not only makes the circuit board smaller and lighter, which is conducive to the thinness of the equipment, but also realizes automated production to ensure the consistency and reliability of product quality.

The gold finger process should not be ignored either. In view of the frequent operations such as mobile phone charging, data transmission, and computer expansion card plugging and unplugging, the gold finger process is particularly important. In the expansion card interface of the computer host and the mobile phone charging interface board, etc., through special metal plating treatment, the gold finger can ensure good contact and stable signal transmission when plugging and unplugging. It is also wear-resistant and anti-oxidation, can withstand frequent plugging and unplugging, extend the service life of the equipment, and ensure the reliability of the connection.

ONESEINE has always focused on the research and optimization of these processes. In the business we are involved in, we strive to provide high-quality products for the production of mobile phones and computer circuit boards to help the progress of the industry.