Two key points to prevent warpage of rigid PCB circuit board

Two key points to prevent warpage of rigid PCB circuit board

The two main reasons for the warping of rigid circuit boards are: 1. The storage method of base materials is incorrect, 2. The warping of rigid circuit boards is caused by improper production operation. It is possible to avoid these two problems if you observe them carefully. This chapter focuses on the warping of rigid circuit boards in detail! In terms of storage: (1) Because the copper clad laminate will increase warpage due to moisture absorption during storage, the single-sided copper clad laminate has a large hygroscopic area. If the humidity of the storage environment is high, the single-sided copper clad laminate will greatly increase warpage. The moisture of the double-sided copper clad laminate can only penetrate from the end face of the product, the moisture absorption area is small, and the warpage changes slowly. For the copper clad laminate without moisture-proof packaging, Pay attention to the warehouse conditions to minimize the humidity in the warehouse and avoid exposed copper clad laminate to avoid warping during storage. Improper placement of the copper clad laminate will increase the warpage, and the vertical placement or heavy objects on the copper clad laminate will increase the warpage of the copper clad laminate. For PCB rigid board, attention must also be paid to the anti-interference ability of the whole board. The conventional method is: A. Add a filter capacitor near the power supply and ground of each IC, with a capacity of 473 or 104; B. For the sensitive signal on the printed circuit board, the attached shielded wire should be added separately, and the wiring near the signal source should be as small as possible; C. Select a reasonable grounding point.