What is the copper deposition process of pcb？

What is the copper deposition process of pcb？

The importance of copper deposition process of pcb for production of circuit board

What is the purpose of pcb copper deposition is to deposit a layer of 0.3um-0.5um copper on the hole wall through chemical reaction, so that the hole wall has conductivity, which is also known as "electroless copper plating" and "holeization". Chemical copper is widely used in the production and processing of printed circuit boards with through-holes. Its main purpose is to deposit a layer of copper on the non-conductive substrate through a series of chemical treatment methods, and then thicken it to reach the designed specific thickness through subsequent electroplating methods. Generally, it is 1mil (25.4um) or thicker, and sometimes it is even directly deposited to the entire line copper thickness through chemical methods, Chemical copper process is to complete the deposition of chemical copper through a series of necessary steps, each of which is very important for the whole process. The conventional pcb circuit board is produced and processed on a non-conductive composite substrate (epoxy resin-glass fiber cloth substrate, phenolic paper substrate, polyester glass fiber board, etc.) by etching (on the copper-clad substrate) or electroless plating (on the copper-clad substrate or physical copper foil substrate). The importance of pcb copper deposition process, and the reason why copper deposition is the core process in the production of circuit boards: because the circuit generates specific functions through current, and copper is the only carrier of conductivity. The failure of copper deposition anywhere on the circuit board will result in the loss of functions here and even the whole board.