Reasons of warpage in PCB process-ONESEINE top 10 pcb manufacturers in world

Reasons of warpage in PCB process-ONESEINE top 10 PCB manufacturers in world

Warpage in PCB process may be caused by many factors. Here are several main reasons summarized by the editor:

1. Temperature change and humidity effect

PCB circuit boards may warp when the temperature changes. When the temperature rises, the circuit board may warp upward; when the temperature drops, the circuit board may warp downward. In addition, PCB circuit boards may also warp when the humidity is high. The effect of humidity on circuit boards is mainly due to the hygroscopicity of the material. When the circuit board is exposed to a high humidity environment, moisture enters the material of the circuit board, causing the shape of the circuit board to change.

2. Mechanical stress

Mechanical stress is another factor that causes PCB circuit board warpage. For example, during the manufacturing process, the circuit board may be subjected to bending or twisting forces, which may cause the shape of the circuit board to change. In addition, the mechanical stress applied during the installation process may also cause the circuit board to warp.

3. Circuit design issues

Circuit design may also have an impact on the warpage of the PCB circuit board. For example, if the circuit design is unreasonable, it may cause uneven temperature distribution of the circuit board, causing warpage.

4. Material Selection

The choice of PCB materials may also have an impact on warpage. Different materials have different physical properties, such as thermal expansion coefficient and elastic modulus, which may affect the warpage of the board.

5. Multilayer board structure

During the production process of multilayer boards, the materials of each layer may be different, which may cause differences in thermal expansion coefficient and elastic modulus between layers. These differences may cause stress in the structure of the multilayer board, resulting in warpage.

6. Manufacturing process issues

The manufacturing process is also an important factor affecting the warpage of PCB boards. For example, there may be residual stresses in the manufacturing process, which may cause the board to warp during subsequent use. In addition, the heating and cooling steps in the manufacturing process may also affect the warpage of the board.

7. Environmental factors

Environmental factors may also have an impact on the warpage of PCB boards. For example, in certain environments, such as high temperature or high humidity environments, the board may be more prone to warpage. In addition, some chemicals may also have an impact on the materials of the board, causing warpage.

8. Improper storage and handling

Improper storage and handling may also cause PCB board warpage. For example, if the board is subjected to bending or twisting forces during storage or handling, this may cause the board's shape to change. In addition, the humidity and temperature in the storage environment may also have an impact on the warping of the board.

In summary, the warping problem in the PCB process is the result of a combination of factors. Understanding these causes is crucial to developing corresponding prevention and solutions.