High Frequency PCB

PTFE High Frequency Teflon 2 Layer Black OSP F4B PCB Board

ptfe pcb
teflon pcb
OSP PCB
Black pcb
Product description: ptfe ptfe pcb laminate
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PTFE High Frequency Teflon 2 Layer Black OSP F4B PCB Board

Material	F4bM	Copper	1OZ
Layer	2	Size	2*3CM
Surface finish	OSP	Solder mask	Black
Thickness	1.6mm	Min line	5mil

F4B-1/2 is laminated with excellent material according to the requirements of microwave circuit in electrical performance. It is a kind of laminate of microwave PCB due to its excellent electrical performance and higher mechanical strength.
Teflon woven glass fabric copper-clad laminates with high permittivity
F4BK-1/2
F4BK-1/2 is laminated by laying up of varnished glass cloth with Teflon resin， according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance（wider range of dielectric constant）.
Teflon woven glass fabric copper-clad laminates with high permittivity
F4BM-1/2
F4BM-1/2 is laminated by laying up of varnished glass cloth with Teflon resin， according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance（wider range of dielectric constant、lower dielectric loss angle tangent、increased resistance、and more stability of performance）.
Teflon woven glass fabric copper-clad laminates with high permittivity
F4BMX-1/2
F4BMX-1/2 is laminated by laying up of varnished glass cloth with Teflon resin， according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance（wider range of dielectric constant、lower dielectric loss angle tangent、increased resistance、and more stability of performance）.Compared with the F4BM，the consistency of the laminate various properties can be insured through using the imported woven glass fabric.
Teflon woven glass fabric copper-clad laminates with high permittivity
F4BME-1/2
F4BME-1/2 is laminated by laying up of the imported varnished glass cloth with Teflon resin，according to the scientific formulation and strict technology process. This product takes some advantages over F4BM series in the electrical performance and the passive intermodulation indicators increased.
Teflon woven glass fabric copper-clad laminates with ceramic filled
F4BT-1/2
F4BT-1/2 is a micro dispersed ceramic PTFE composite with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. This product have higher dielectric constant than the traditional PTFE copper clad laminates to meet the design and manufacturing of circuit miniaturization. Due to filling with the ceramic powder，F4BT-1/2have a low Z axis coefficient of thermal expansion ensures excellent reliability of plated through-holes. Besides，because of the high thermal conductivity，advantage to the heat dissipation of apparatus.
F4BDZ294
1．Introduction：
F4BDZ294 is a kind of Teflon woven glass fabric planar resistor copper-clad laminates with the dielectric constant of 2.94. This kind of high frequency laminates is manufactured by Teflon woven glass fabric（with low dielectric constant and low dissipation factor）with the planar resistor copper foil. It features with excellent electrical and mechanical performance. Its high mechanical reliability and excellent electrical stability is suitable for the design of the complicated microwave circuit.
Structure of the material：One side is clad with resistor copper foil，and the other side is clad with traditional copper foil，and the dielectric material with Teflon woven glass fabric. The dielectric constant is 2.94.
Features of the material：low dielectric constant and loss；excellent electrical / mechanical performance；lower thermal coefficient of dielectric constant；low outgassing.
2．Application scope
（1）Ground-based and airborne radar system；
（2）Phased array antenna；
（3）GPS antenna；
（4）Power backboard；
（5）Multilayer PCB；
（6）Spotlight network.
Metal base Teflon woven glass fabric copper-clad laminates
F4B-1/AL（Cu）
F4B-1/AL（Cu） is a kind of microwave circuit metal base material based on Teflon woven glass fabric copper-clad laminates，which is pressed with copper on one side、and aluminum（copper）plate on the other side.
Teflon copper-clad laminates
F4T-1/2
F4T-1/2 is a kind of circuit laminate based on the Teflon board，which is compressed with electrolytic copper foil（after oxidation treatment）on both sides，and then pressed together after high temperature and high pressure. This product takes some advantages in the electrical performance（low dielectric constant、low dielectric loss angle tangent）. It is a good kind of laminate of microwave PCB due to its higher mechanical strength.
Microwave composite dielectric copper-clad substrate
TP-1/2
The advantage of design for microwave circuit using TP-1/2 here：
（1）The dielectric constant is stable and can be optional within the range of 3~16 according to the design of circuit requirement. The operating temperature is -100℃～+150℃；
（2）The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processing，higher pass-rate of production，and the manufacturing cost is much lower than the ceramic substrate.
（3）Dissipation factor tgδ≤1×10-3，and the loss has a slight variation with the rise of the frequency.
（4）It is easy for mechanical manufacturing，including drill、punch、grind、cut、etching，etc.. For these，the ceramic substrate cannot be compared.
A special microwave composite dielectric copper-clad substrate
TPH-1/2
TPH-1/2 is made of a new type of inorganic and organic materials，with special process and compounding.
The advantage of design for microwave circuit using TPH-1/2 here：
（1）The substrate is black. The dielectric constant is 2.65，with consistent performance over broad temperature and frequency ranges. The operating temperature is -100℃～+150℃；
（2）The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processing，higher pass-rate of production，and the manufacturing cost is much lower than the ceramic substrate.
（3）Dissipation factor tgδ≤1×10-3，and the loss has a slight variation with the rise of the frequency.
（4）It is easy for mechanical manufacturing，including drill、punch、grind、cut、etching，etc.. For these，the ceramic substrate cannot be compared.
（5） Due to the specific gravity less，the remarkable characteristics of the module are weight lighter manufacturing by this substrate，which but other materials cant compare.
（6）Copper thickness is：0.035μm
Teflon ceramic composite dielectric substrate
TF-1/2
TF-1/2 is a kind of circuit laminate based on the Teflon（which have excellent microwave and temperature resistance performance）compound with ceramic. This kind of laminate can be comparable with the products（such as RT/duroid 6006/6010/TMM10）from Rogers Corporation in United State of America.
The advantage of design for microwave circuit using TF-1/2 here：
（1）The operating temperature is much higher than TP-series. It is applicable to long-term operation within temperature ranger of -80℃～+200℃，and can be used for wave-welding and melt-back welding.
（2）Used for the manufacturing of the microwave and millimeter wave printed circuit board .
（3）Better radiation performance，30min20rad/cm2.
（4）Dielectric property is stable and has a slight variation with the rise of temperature and frequency.
Teflon woven glass fabric
F4B-N / F4B-J / F4B-T
This product is the raw material for the Teflon woven glass fabric copper-clad laminates. Dipping treatment of the Teflon resin on the alkali-free woven glass fabric，drying、baking and sintering，the microwave material is formulated. This product is characterized by some features，such as heat-resistance、insulation、low loss、excellent electrical performance、in-adhesion. The Teflon woven glass fabric is Widely used in electronics、motor、aviation、textile、chemical and food industry，etc.. In the area of microwave devices，it can be used as the bond film for the manufacturing of multilayer printed circuit board.
1．Type of material
（1）Anti-sticking Teflon woven glass fabric：F4B-N ；
（2）Insulation Teflon woven glass fabric：F4B-J ；
（3）Ventilated Teflon woven glass fabric：F4B-T .