High Frequency Laminates RT/duroid® 6002 microwave material was the fi rst low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable. The thermal coeffi cient of dielectric constant is extremely low from -55oC to+150oC (-67°F to 302°F) which provides the designers of fi lters, oscillators and delay lines the electrical stability needed in today’s demanding applications. A low Z axis coeffi cient of thermal expansion (CTE) ensures excellent reliability of plated through-holes. RT/duroid 6002 materials have been successfully temperature cycled (-55oC to 125oC [-67°F to 257°F]) for over 5000 cycles without a single via failure. Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coeffi cient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances. The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal, (6 ppm/oC) further increasing surface mount reliability. ½ oz. to 2 oz./ft.2 electrodeposited copper, ½ oz. to 1 oz. reverse treated electrodeposited copper or ½ oz. to 2 oz./ ft.2 rolled copper may be specifi ed as cladding on dielectric thicknesses from 0.005” to 0.125” (0.13 to 3.18mm). RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates and resistive foils. Applications particularly suited to the unique properties of RT/duroid 6002 material include fl at and non-planar structures such as antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments. RT/duroid 6002 laminates have Underwriters Laboratories recognition under classifi cation 94V-0 (Vertical Flammability Test).
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