RO4400™ Series Bondply Data Sheet RO4450B™and RO4450F™ Bondply
RO4000® dielectric materials have long been used in combination with FR-4 cores and bondplys as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ , and RO4000 LoPro™ glass reinforced hydrocarbon/ceramic laminates have been used in layers where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. FR-4 cores and bondply are still commonly used to inexpensively form less critical signal layers. The RO4400™ bondply family is comprised of three grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with either RO4003C, RO4350B or RO4000 LoPro laminates. A high postcure Tg (>280°C / >536°F ) makes RO4400 series bondply an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 bondplys are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements (177°C/350°F) permit RO4400 bondply and low fl ow FR-4 bondply to be combined into non-homogeneous multi-layer constructions using a single bond cycle. RO4450F™ bondply has demonstrated improvement in lateral fl ow capability, and is becoming the fi rst choice for new designs or as a replacement in designs that have diffi cult fi ll requirements. Each of the RO4450B and RO4450F bondplys are recognized by Underwriter Laboratories with the UL-94 fl ame rating, and are compatible with lead-free processes.
Tracy
Tracy