Rogers PCB

Rogers 3003 0.8mm Thickness Gold Plated High Level Quality PCB Circuit Boards

rogers pcb
rogers 3003 pcb
0.8mm thickness pcb
Gold plated pcb
Product description: Rogers 4003C PCB rogers fr4 pcb stack up pcb Rogers 4360 pcb Rogers Custom PCB Maker Rogers PCB Fabrication rogers pcb price rogers pcb manufacturers rogers pcb prototype rogers pcb calculato
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Rogers 3003 Gold Plated High Level Quality PCB Circuit Boards

Quick detail:

Material:High frequency rogers 3003

Layer:2

Surface finish:Gold plated

Board size:6*3cm

Thickness:0.8mm

Copper weight:0.5OZ

Name:rogers 3003 gold plated high level qulity PCB printed circuit boards

Rogers - High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminat ( not PTFE ) designed for performance sensitive, high volume commercial applications

Rogers 3003 PCB:

The RO3003 from Rogers Corp. is a ceramic-filled PTFE composite/laminate for use in commercial microwave and RF applications. It features excellent stability with a dielectric constant of 3 up to 40 GHz at room temperature. The material has a dissipation factor (Df) of 0.0013 at 10 GHz and is ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

By far the most commonly used is the Rogers RO4000 series of high frequency materials.

RO4350B laminate is a hydrocarbon/ceramic base, which can be manufactured using

standard FR-4 type multilayer processes, making it not only popular but economical to

manufacture. Low dielectric loss is the major appealing characteristic of this material.

Multilayers can be constructed of a “pure package” using Rogers 4450 prepreg, or by using standard FR-4 prepreg. Popular constructions limit the Rogers material to the “caps” of the stackup thereby managing overall cost by using the material only where it is required, and filling the remainder of the board with standard FR-4 cores/prepreg.

PTFE, commonly known as “Teflon” is another fairly common callout for this genre’s

material requirements. There are many different formulations and laminates such as

Rogers 3000 series ceramic-filled PTFE composites, R/T Duroid 5870 and 5880 glass

microfiber reinforced PTFE, etc. They can be very difficult in multilayer configurations

however, as some require the use of high temperature bonding films or adhesives. The old saying that “nothing likes to stick to Teflon!” sometimes holds true! But their extremely low loss characteristics make them ideal for exacting stripline and microstrip circuit designs.

PCB basic information:

Oneseine Technology Go.,LTD
Seq	Item	capability
1	Base Material	FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc
2	Layers	1-40 ( ≥30 layers needs review )
3	Finished inner/outer copper thickness	0.5-6OZ
4	Finished board thickness	0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL
4	Finished board thickness	Board thickness≤1.0mm: +/-0.1mm 1 Board thickness>2.0mm: +/-8%
5	Max panel size	≤2sidesPCB: 6001500mm Multilayer PCB: 5001200mm
6	Min conductor line width/spacing	Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil
7	Min hole size	Mechanical hole: 0.15mm Laser hole: 0.1mm
7	Min hole size	Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil
8	Warpage	Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5%
9	Controlled Impedance	+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review)
10	Aspect Ratio	15:01
11	Min welding ring	4mil
12	Min solder mask bridge	≥0.08mm
13	Plugging vias capability	0.2-0.8mm
14	Hole tolerance	PTH: +/-3mil NPTH: +/-2mil
15	Outline profile	Rout/ V-cut/ Bridge/ Stamp hole
16	Solder mask color	Green,yellow,black,blue,red,white,matte green
17	Component mark color	white,yellow,black
18	Surface treatment	OSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’
19	E-Test	Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch
		Min spacing from test pad to board edge : 0.5 mm
		Min conductive resistance : 5 Ω
		Max insulation resistance : 250 MΩ
		Max test voltage : 500 V
		Min test pad diameter : 6 mil
		Min test pad to pad spacing : 10 mil
		Max test current : 200 MA
20	AOI	Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch
20	AOI	Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch