Custom FR4 Material Multilayer 4 Layer Half Hole Bluetooth PCB Board

Technology

 Capabilities

 Capabilities

Max.Layer Count

  30 Layers

  30 Layers

Max.Panel Size

  27.5"x24"

  27.5"x24"

Max.Board Thickness

  3.5mm

  5.8mm

Outer Layer

  3.5/3.5mils

  3/3mils

Inner Layer

  3.5/3.5mils

  3/3mils

Min.Board Thickness

  2L:6mils

  2L:6mils

  4L:15mils

  4L:15mils

  6L:23mils

  6L:23mils

Min.SMT/BGA Pitch

  12mils for SMT

  12mils for SMT

  24mils for BGA

  20mils for BGA

Min.Drill Size&Aspect Ratio

  0.2mm Drill for 0.8mm   Thickness(4.0:1)

  0.2mm Drill for 0.8mm
  Thickness(4.0:1)

  0.25mm Drill for 1.6mm
  Thickness(6.4:1)

  0.25mm Drill for 1.6mm
  Thickness(6.4:1)

  0.30mm Drill for 2.4mm
  Thickness(8.0:1)

  0.30mm Drill for 2.4mm
  Thickness(8.0:1)

Surface Finishes

  HASL

  HASL

  Selective Immersion Tin

  Selective Immersion  Tin

  Immersion Silver

  Immersion Silver

  Immersion Gold

  Immersion Gold

  Hard Gold

  Hard Gold

  OSP

  OSP

  Gold finger

  Gold finger

Controlled Impedance

  +/- 10%

  +/-7%

Contouring

  Routing, V-Groove,

  Routing, V-Groove,

  Beveling Punch

  Beveling Punch

Hole Diameter

  +/- 2 mil

  +/- 2 mil

Min.S/M Thickness

  0.4 mil

  0.6 mil