Multilayer PCB
Rogers4350 FR4 Mixed Dielectric Hybrid stack-up PCB Prototype
- multilayer pcb
- Rogers PCB
- stack up pcb
- fr4 pcb
- Product description: Rogers4350 FR4 Mixed Dielectric Hybrid stack-up PCB Prototype
Rogers4350 FR4 Mixed Dielectric Hybrid stack-up PCB Prototype
General info.:
Base material: rogers 4350 0.203mm+fr4
Layer:4
Surface finish:Immersion gold
Board size: 15.9*8.5cm
Final board thickness:1.5mm
Min trace width:0.2mm
Solder mask and silk: Yes
Stack up file:
Prototype time:8-10 days
4layers with 3 cores,calculate as 8layers.fake 8layer
Mixed high frequency construction can reduce costs when the need for RF dielectric is local and only between some layers. The rest of the dielectric can be FR4 or halogen-free FR4. It is also possible to combine PTFE (Teflon) materials with FR4.
Cross section of mixed Rogers 4350B, high Tg FR4 and embedded C-coin:
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Tel: 0086 18682010757
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