One-stop Turnkey PCB Manufacturer Assembly Service

One-stop Turnkey PCB manufacturer Assembly Service

General PCBA Information:

Base material:FR4 epoxy resin

Board thickness:1.6mm

Surface finish:Immersion gold

Board size:7.2*17.3CM

Copper thickness:1OZ

Solder mask and silkscreen: green and white

Components sourcing:yes

Our PCBA Capability

SMT, PTH, mixed technology

SMT: 2,000,000 solder joints per day

DIP: 300,000 joints per day

Ultra fine pitch, QFP, BGA, μBGA, CBGA

Advanced SMT assembly

Automated insertion of PTH (axial, radial, dip)

Cleanable, aqueous and lead-free processing

RF manufacturing expertise

Peripheral process capabilities

Press fit back planes & mid planes

Device programming

Automated conformal coating

For E-Test

Universal Tester

Flying Probe Open/Short Tester

High power Microscope

Solder ability Testing Kit

Peel Strength tester

High Volt Open & Short tester

Cross Section Molding Kit With Polisher

Technical requirement for pcb assembly: What we can do?
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603,0402,0201 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.

 Quote requirement for pcb and pcb assembly:
1)Gerber file and Bom list Gerber file,PCB file,Eagle file or CAD file all acceptable 
2)Clear pics of pcba or pcba sample for us This will help a lot for the fast purchasing as request
3)Test method for PCBA This can guarantee 100% good quality products when delivered

Assembly Capabilities

· Printed Circuit Board Assembly (PCBA)

· Through Hole

· Surface Mount (SMT)

· PCB Handling up to 400mm x 500mm

· RoHS Compliance Production

· Non RoHS Production – where permitted

· AOI

Component Technologies

· Passive Down to 0201 size

· BGA and VFBGA

· Leadless Chip Carriers/CSP

· Fine Pitch to 0.8mils

· BGA Repair and Reball

· Part Removal and Replacement

Production Details:

1) Material Management

Supplier → Components Purchase → IQC → Protection Control → Material Supply → Firmware

2) Program Management

PCB Files → DCC → Program Organizing → Optimization → Checking

3) SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

4) PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment